Invention Grant
- Patent Title: Stable high solids, high thermal conductivity pastes
- Patent Title (中): 稳定的高固体，高导热性浆料
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Application No.: US431283Application Date: 1989-11-03
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Publication No.: US5098609APublication Date: 1992-03-24
- Inventor: Sushumna Iruvanti , Rakesh K. Gupta , Eli Ruckenstein
- Applicant: Sushumna Iruvanti , Rakesh K. Gupta , Eli Ruckenstein
- Applicant Address: NY Albany
- Assignee: The Research Foundation of State Univ. of N.Y.
- Current Assignee: The Research Foundation of State Univ. of N.Y.
- Current Assignee Address: NY Albany
- Main IPC: C09K5/08
- IPC: C09K5/08 ; H01B1/20 ; H01B1/22 ; H01B1/24 ; H01L23/373
Abstract:
A paste including a thermally conducting solid filler, a nonaqueous liquid carrier and a stabilizing dispersant. The pastes are highly concentrated, of low viscosity, electrically resistive, highly thermally conducting and stable. The pastes are easily applicable to electrical and electronic devices and may be removed therefrom with common solvents to access components where necessary.
Public/Granted literature
- US5650929A Modular electronic display and accessory mounting system for a vehicle Public/Granted day:1997-07-22
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