发明授权
- 专利标题: Electrical contact alloy
- 专利标题(中): 电接触合金
-
申请号: US357195申请日: 1989-05-26
-
公开(公告)号: US5098655A公开(公告)日: 1992-03-24
- 发明人: Masatoshi Ohba
- 申请人: Masatoshi Ohba
- 申请人地址: JPX Kyoto
- 专利权人: Omron Tateisi Electronics Co.
- 当前专利权人: Omron Tateisi Electronics Co.
- 当前专利权人地址: JPX Kyoto
- 优先权: JPX63-131193 19880528; JPX63-131194 19880528
- 主分类号: C22C5/02
- IPC分类号: C22C5/02 ; H01H1/023
摘要:
The electrical contact alloy is provided comprising Sb and either Au or Ag or both. In such alloys, Sb produces a non-catalytic effect to inhibit formation of carbon from organic gases derived from resin parts. Therefore, when electrical contacts of such alloys are assembled with resin parts into housings, poor contact due to carbon deposition is prevented to increase the useful life and reliability of the electrical contacts.
公开/授权文献
信息查询