Invention Grant
- Patent Title: Sealing and shielding structure
- Patent Title (中): 密封和屏蔽结构
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Application No.: US583725Application Date: 1990-09-14
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Publication No.: US5107071APublication Date: 1992-04-21
- Inventor: Asaharu Nakagawa
- Applicant: Asaharu Nakagawa
- Applicant Address: JPX Nagoya
- Assignee: Kitagawa Industries Co., Ltd.
- Current Assignee: Kitagawa Industries Co., Ltd.
- Current Assignee Address: JPX Nagoya
- Priority: JPX1-241559 19890918
- Main IPC: H05K9/00
- IPC: H05K9/00
Abstract:
A sealing and shielding structure of the present invention comprises an elastic sealing member and an electromagnetic shideling member provided in a cavity formed at least in one of a first member and a second member both of which have conductive abutting faces. The elastic sealing member is, for example, slightly larger than the electromagnetic shielding member so as to be pressed between the first and the second members. Accordingly, when the first and the second members are closed, the elastic sealing member is compressed and deformed to push the electromagnetic shielding member so that the electromagnetic shielding member closely contacts with the conductive abutting faces of the first and the second members. Consequently, the sealing and shielding structure can produce a prominent electromagnetic wave shielding effect because of the electromagnetic shielding member kept in close contact with the conductive abutting faces of the first and the second members.
Public/Granted literature
- US6126814A Selective hydrodesulfurization process (HEN-9601) Public/Granted day:2000-10-03
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