发明授权
- 专利标题： Surface mount device with high thermal conductivity
- 专利标题（中）： 具有高导热性的表面贴装器件
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申请号： US677078申请日： 1991-03-29
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公开(公告)号： US5111277A公开(公告)日： 1992-05-05
- 发明人: Manuel Medeiros, III , Jay S. Greenspan
- 申请人： Manuel Medeiros, III , Jay S. Greenspan
- 申请人地址： MA New Bedford
- 专利权人： Aegis, Inc.
- 当前专利权人： Aegis, Inc.
- 当前专利权人地址： MA New Bedford
- 主分类号： H01L23/06
- IPC分类号： H01L23/06 ; H01L23/043 ; H01L23/045 ; H01L23/08
摘要：
A surface mount package for encapsulating an electronic device is provided. The package has a ceramic frame containing a plurality of apertures. Copper-tungsten composite metallic components are bonded to the ceramic frame and individually extend across each of the apertures. The metallic components may include a flange for bonding and a pedestal extending into each aperture.
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