An apparatus for removing the dispersion medium in a metal or ceramic molded body which comprises a dispersion medium-removing vessel includes a condensing zone located in a upper part and a boiling zone located in a lower part, a separator to separater a solvent in the dispersion medium solution discharged from the vessel by heating the solution at a temperature higher than the boiling point of the solvent to evaporate it, the boiling zone being connected with the separator through a pipe to transport the dispersion medium solution and a pipe to transport the vaporized solvent to form a circuit, and a pump provided in the circuit. In the apparatus since the dispersion medium is removed in the boiling solvent, keeping a constant temperature is easy. The dispersion medium is promptly removed by contacting it with a solution of which the concentration of the dispersion medium is always low due to continuous removal of the dispersion medium in the separator. Since the boiling point of the solvent is about 20.degree. to 150.degree. C., the molded body is gently heated. Therefore, the occurrence of defects such as cracks is rare in the molded body.