发明授权
- 专利标题： Semiconductor device mounted upon an insulating adhesive with silicon dioxide and nickel chromium steel filling particles
- 专利标题（中）： 半导体器件安装在二氧化硅和镍铬钢填充颗粒上的绝缘胶
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申请号： US627573申请日： 1990-12-14
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公开(公告)号： US5113241A公开(公告)日： 1992-05-12
- 发明人: Satoru Yanagida , Kouji Araki , Hikaru Okunoyama , Tetsunori Niimi
- 申请人： Satoru Yanagida , Kouji Araki , Hikaru Okunoyama , Tetsunori Niimi
- 申请人地址： JPX Kawasaki
- 专利权人： Kabushiki Kaisha Toshiba
- 当前专利权人： Kabushiki Kaisha Toshiba
- 当前专利权人地址： JPX Kawasaki
- 优先权： JPX1-324753 19891214
- 主分类号： H01L21/52
- IPC分类号： H01L21/52 ; H01B3/00 ; H01L21/60 ; H01L23/495
摘要：
A semiconductor device comprises a plurality of pellets fixed on a bed by a conductive adhesive agent, an insulating substrate having a junction wiring fixed on the bed between the semiconductor pellets, and wires for connecting the pellets and insulating substrate. The insulating substrate is fixed on the bed by an insulating adhesive agent including filling material such as particles of silicon dioxide and metal particles. The surfaces of the filling material particles are coated with an oxide film.
公开/授权文献
- USD289764S Printer 公开/授权日：1987-05-12