发明授权
- 专利标题： Processes for electrically conductive decals filled with organic insulator material
- 专利标题（中）： 用有机绝缘材料填充的导电贴花的工艺
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申请号： US665497申请日： 1991-03-06
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公开(公告)号： US5116459A公开(公告)日： 1992-05-26
- 发明人: Mark R. Kordus , Mark S. Schneider , Louis H. Wirtz
- 申请人： Mark R. Kordus , Mark S. Schneider , Louis H. Wirtz
- 申请人地址： NY Armonk
- 专利权人： International Business Machines Corporation
- 当前专利权人： International Business Machines Corporation
- 当前专利权人地址： NY Armonk
- 主分类号： H01R43/00
- IPC分类号： H01R43/00 ; H01L21/48 ; H01L21/68 ; H01L23/498 ; H05K3/40
摘要：
The present invention relates generally to new processes for making decals, and more particularly to electrically conductive decals that are filled with organic insulator material. Various methods and processes that are used to make these electrically conductive decals filled with organic dielectric materials are disclosed.
公开/授权文献
- US5748238A Video camera 公开/授权日：1998-05-05