发明授权
- 专利标题: Aluminum alloy clad material
- 专利标题(中): 铝合金材料
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申请号: US674559申请日: 1991-03-22
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公开(公告)号: US5125452A公开(公告)日: 1992-06-30
- 发明人: Shigenori Yamauchi , Yuji Suzuki , Kenji Kato
- 申请人: Shigenori Yamauchi , Yuji Suzuki , Kenji Kato
- 申请人地址: JPX Tokyo JPX Kariya
- 专利权人: Sumitomo Light Metal Industries, Ltd.,Nippondenso Co., Ltd.
- 当前专利权人: Sumitomo Light Metal Industries, Ltd.,Nippondenso Co., Ltd.
- 当前专利权人地址: JPX Tokyo JPX Kariya
- 优先权: JPX2-246268 19900918
- 主分类号: B23K1/19
- IPC分类号: B23K1/19 ; B23K35/14 ; B23K35/28 ; B32B15/01 ; C22C21/00 ; F28F19/06 ; F28F21/08
摘要:
Disclosed is an aluminum alloy clad material and a heat exchanger using the clad material, the clad material being composed of: (a) a core material made of an aluminum alloy consisting essentially of, in weight percentage, 0.3 to 1.5% manganese, 0.05 to 0.35% copper, 0.05 to 0.50% magnesium, 0.06 to 0.35% titanium, less than 0.1% silicon and up to 0.3% iron, the copper content being related to the magnesium content in accordance with the following equation: Cu(%)-0.2.ltoreq.Mg(%).ltoreq.Cu(%)+0.2, the balance being aluminum and incidental impurities; and (b) a cladding material made of an Si-containing aluminum alloy brazing filler material clad onto at one or both sides of the core material. The aluminum alloy clad material is superior in press formability, corrosion resistance and brazability. Particularly, when the percentage of fine Mn compounds of 0.1 .mu.m or less and the Ti content variation in the core material are controlled, further improved properties can be obtained.
公开/授权文献
- US5868304A Socketable bump grid array shaped-solder on copper spheres 公开/授权日:1999-02-09
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