发明授权
- 专利标题: Composite foams of low thermal conductivity
- 专利标题(中): 低导热性的复合泡沫
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申请号: US825356申请日: 1992-01-24
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公开(公告)号: US5137927A公开(公告)日: 1992-08-11
- 发明人: Bernardo Wolff , Frieder Hohwiller , Guenther Seybold
- 申请人: Bernardo Wolff , Frieder Hohwiller , Guenther Seybold
- 申请人地址: DEX Ludwigshafen
- 专利权人: BASF Aktiengesellschaft
- 当前专利权人: BASF Aktiengesellschaft
- 当前专利权人地址: DEX Ludwigshafen
- 优先权: DEX4038784 19901205
- 主分类号: C08J9/14
- IPC分类号: C08J9/14 ; C08J9/32 ; C08J9/35 ; C08K3/36 ; C08K7/00 ; C08K7/26 ; C08L25/04
摘要:
A composite foam of low thermal conductivity comprisesa) 20-80% by volume of silica aerogel particles having a mean diameter of from 0.1 to 20 mm and a density of from 0.08 to 0.40 g/cm.sup.3,b) 20-80% by volume of a styrene polymer foam which surrounds the particles of component a) and binds them to one another and has a density of from 0.01 to 0.15 g/cm.sup.3, and, if desired,c) conventional additives in effective amounts.
公开/授权文献
- US5790559A Semiconductor memory testing apparatus 公开/授权日:1998-08-04
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