发明授权
US5138521A Electronic component assembly with direct mounting for proper and
effective cooling
失效
具有直接安装的电子元件组件，用于正确和有效的冷却
- 专利标题： Electronic component assembly with direct mounting for proper and effective cooling
- 专利标题（中）： 具有直接安装的电子元件组件，用于正确和有效的冷却
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申请号： US506549申请日： 1990-04-06
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公开(公告)号： US5138521A公开(公告)日： 1992-08-11
- 发明人: Makoto Watanabe , Hiroyuki Nishi , Keiji Gemma
- 申请人： Makoto Watanabe , Hiroyuki Nishi , Keiji Gemma
- 申请人地址： JPX Kyoto
- 专利权人： Omron Tateisi Electronics Co.
- 当前专利权人： Omron Tateisi Electronics Co.
- 当前专利权人地址： JPX Kyoto
- 优先权： JPX60-51334[U] 19850405; JPX60-199099 19850909; JPX60-146266[U]JPX 19850924
- 主分类号： H05K7/14
- IPC分类号： H05K7/14 ; H05K7/20
摘要：
This electronic component assembly includes: a body construction comprising a planar base portion, a fin provided as projecting from the planar base portion of the body construction, and a heat generating element fixedly attached to the planar base portion of the body construction. Thereby, very good heat dissipation is made available for the heat generating element, since no intermediate heat dissipating plate is used.