A package includes one or more flanged cups, the cups being arranged and interconnected at their respective flanges to form an array. A paperboard cover having a polygonal main panel of an area generally corresponding to the area of the interconnected cup flanges is disposed over the array. A side panel is connected along an upper fold line to each side edge of the main panel, with each of the side panels projecting generally downwardly from the main panel. Each adjacent pair of side panels is foldably connected at their respective end edges through a pair of foldably interconnected web panels, the angle defined between each end edge of the side panels and the corresponding upper fold line being less than ninety degrees. Each of the web panel pairs are attached together in overlapping arrangement and disposed behind an associated one of the side panels, whereby the side panels are tapered inwardly with respect to the cups to secure the main panel to the cup array.