发明授权
- 专利标题： SAW device
- 专利标题（中）： SAW器件
-
申请号： US549643申请日： 1990-07-09
-
公开(公告)号： US5144185A公开(公告)日： 1992-09-01
- 发明人: Akitsuna Yuhara , Jun Sasaki , Hiromi Isomae , Shozi Kawakubo , Jun Yamada
- 申请人： Akitsuna Yuhara , Jun Sasaki , Hiromi Isomae , Shozi Kawakubo , Jun Yamada
- 申请人地址： JPX Tokyo
- 专利权人： Hitachi, Ltd.
- 当前专利权人： Hitachi, Ltd.
- 当前专利权人地址： JPX Tokyo
- 优先权： JPX3428/86 19860113; JPX46138/86 19860305
- 主分类号： H03H3/08
- IPC分类号： H03H3/08 ; H03H9/145
摘要：
A SAW device having a piezoelectric substrate and interleaved metal electrodes formed on the substrate, in which the formation of the electrodes on the substrate is carried out by sputtering. Further, the metal electrodes may contain an additive of Cu, Ti, Zn, Mg, Fe, Ni, Cr, Ga, Ge, Sn, Pd or Ta. The resulting SAW device is capable of dealing with high frequency electric signals of a larger amplitude, or higher power electric signals, as compared with the conventional SAW device.
公开/授权文献
- US5580440A Air fuel ratio sensory 公开/授权日：1996-12-03
信息查询
