The invention is directed to a device and method for profiling and deburring a workpiece. The device includes a profiler having a cutting edge for profiling a workpiece, a deburrer having a cutting edge for deburring profiled edges of a workpiece, and a yoke for supporting the profiler and the deburrer in opposed relation on opposite sides of a planar work position, the yoke being movable along a z-axis perpendicular to the work position to alternately move the cutting edges of the profiler and the deburrer toward and away from a workpiece in the work position. The yoke is also movable so that the cutting edges can be maneuvered in a working plane transverse to the z-axis. The method of the present invention includes the steps of positioning a workpiece in a working plane between a profiler and a deburrer, moving the yoke in a first direction to cause a cutting edge of the profiler to move into the working plane, moving the profiling cutting edge in a first predetermined pattern about at least a first portion of the workpiece, moving a cutting edge of the deburrer device into the working plane, and moving the deburring cutting edge about the first portion of the workpiece in a second predetermined pattern corresponding to the first predetermined pattern.