Novel polypropylene-polyamide molding compositions which comprise, based on 100 parts by weight of the molding compositions,A) 10 to 89.9 parts by weight of one or more polypropylene homopolymer and/or copolymer,B) 10 to 89.9 parts by weight of one or more polyamide,C) 0.1 to 5.0 parts by weight of one or more olefinically unsaturated carboxylic acid and/or one or more olefinically unsaturated carboxylic acid derivate,D) 0 to 3.0 parts by weight of an impact modifier, andE) 0 to 60.0 parts by weight of a reinforcing agent and/or additive,are prepared by melting together components (A), (C) and, if desired (D) at from 200.degree. to 300.degree. C. in a first reaction step and then, in a second reaction step, introducing component (B) and, if appropriate, components (D) and/or (E) into the modified melt obtained, and melting together the components.The molding compositions obtained are used for the production of moldings.