发明授权
- 专利标题: Post-termination apparatus and process for thick film resistors of printed circuit boards
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申请号: US724011申请日: 1991-07-01
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公开(公告)号: US5164698A公开(公告)日: 1992-11-17
- 发明人: Ponnusamy Palanisamy
- 申请人: Ponnusamy Palanisamy
- 申请人地址: IN Kokomo
- 专利权人: Delco Electronics Corporation
- 当前专利权人: Delco Electronics Corporation
- 当前专利权人地址: IN Kokomo
- 主分类号: H01C17/06
- IPC分类号: H01C17/06 ; H01C1/142 ; H01C7/00 ; H01C17/28 ; H05K1/03 ; H05K1/09 ; H05K1/16
摘要:
A printed circuit board includes both high and low resistive value thick film resistors interconnected by a copper film. To lower the contact resistance to the thick film resistors of high value, each is provided at its ends with a termination of a composition similar to that used for the low value resistors. This provides a relatively low resistance contact region which overcomes the difficulty that a copper thick film conductor has in making electrical connections to compositions generally used for making high value thick film resistors. The composition of high and low resistivities are adapted to permit firing of both compositions in a single firing step.