发明授权
- 专利标题: Wire-cut electroerosion apparatus
- 专利标题(中): 线切割电子设备
-
申请号: US783347申请日: 1991-10-28
-
公开(公告)号: US5171955A公开(公告)日: 1992-12-15
- 发明人: Akio Hosaka , Gen Itoh , Hidehito Hori , Yoshihiro Watanabe
- 申请人: Akio Hosaka , Gen Itoh , Hidehito Hori , Yoshihiro Watanabe
- 申请人地址: JPX Yokohama
- 专利权人: Sodick Co., Ltd.
- 当前专利权人: Sodick Co., Ltd.
- 当前专利权人地址: JPX Yokohama
- 优先权: JPX2-290326 19901026; JPX3-057814 19910228; JPX3-103964 19910409
- 主分类号: B23H7/02
- IPC分类号: B23H7/02
摘要:
In a wire-cut EDM apparatus for cutting a workpiece (2) submerged in a processing tank (3) filled with a machining fluid (15), an opening (24) is made in the side wall of the tank through which an arm unit passes. A slide plate (14) also has an opening for passage of the arm unit and also provents leakage from the space between the opening 24 and the arm unit. In one preferred embodiment a fluid flow between the slide plate and arm unit is used to prevent fluid in the tank from escaping through the space between the slide plate (14) and the arm unit. Alternatively, a low frictional member may be placed between the arm unit and the slide plate for axially sealing the arm unit. Frictional resistance from movement of the lower arm unit is reduced and machining accuracy improved.