发明授权
- 专利标题： Pressure-reduced chamber system having a filter means
- 专利标题（中）： 具有过滤装置的减压室系统
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申请号： US732911申请日： 1991-07-19
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公开(公告)号： US5178638A公开(公告)日： 1993-01-12
- 发明人: Satoshi Kaneko , Taichi Fugita , Yukimasa Yoshida , Katsuya Okumura
- 申请人： Satoshi Kaneko , Taichi Fugita , Yukimasa Yoshida , Katsuya Okumura
- 申请人地址： JPX Tokyo JPX Kawasaki
- 专利权人： Tokyo Electron Limited,Kabushiki Kaisha Toshiba
- 当前专利权人： Tokyo Electron Limited,Kabushiki Kaisha Toshiba
- 当前专利权人地址： JPX Tokyo JPX Kawasaki
- 优先权： JPX2-192466 19900720
- 主分类号： B25J19/00
- IPC分类号： B25J19/00 ; B25J9/06 ; H01L21/00 ; H01L21/02 ; H01L21/205 ; H01L21/302 ; H01L21/3065 ; H01L21/677
摘要：
The pressure-reduced chamber system of the invention includes a handling mechanism for loading and/or unloading a semiconductor wafer between a process chamber in which a plasma etching is carried out on a semiconductor wafer under a reduced pressure, and a pressure-reduced chamber. Further, the system includes an outer cover for covering the driving force transmitting section of the handling mechanism, a filter mounted to the outer cover such that it defines the inside and outside of the outer cover, and an exhaustion pump for evacuating the space region formed between the outer cover and the pressure-reduced chamber. Thus, when the space region is evacuated by the exhaustion pump, the dust generated from the driving force transmitting section of the handling mechanism is caught by the filter.
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