发明授权
- 专利标题: Process of pretreatment of metal-plating resin molded articles
- 专利标题(中): 金属涂层树脂模制品预处理工艺
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申请号: US632484申请日: 1990-12-24
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公开(公告)号: US5185185A公开(公告)日: 1993-02-09
- 发明人: Chiharu Nishizawa , Yoshiharu Kondo , Masaru Ohto
- 申请人: Chiharu Nishizawa , Yoshiharu Kondo , Masaru Ohto
- 申请人地址: JPX Tokyo
- 专利权人: Mitsubishi Gas Chemical Company, Inc.
- 当前专利权人: Mitsubishi Gas Chemical Company, Inc.
- 当前专利权人地址: JPX Tokyo
- 优先权: JPX1-335171 19891226
- 主分类号: C08J7/00
- IPC分类号: C08J7/00 ; C08J7/12 ; C23C18/22 ; H05K1/03 ; H05K3/18 ; H05K3/38
摘要:
A process of pretreatment of metal-plating a resin molded article molded from a resin composition containing as main components a polyphenylene sulfide (PPS) resin, a glass-reinforcing agent and optionally one or more other thermoplastic resins comprises(1) treating the resin molded article by immersion in an oxidative acid solution (A treatment),(2) treatng the resulting resin molded article by immersion in an organic polar solvent-containing liquid (B treatment), and then(3) treating the resulting resin molded article by immersion in a solvent which can dissolve one or both of the glass reinforcing agent and one or more of the other thermoplastic resins (C treatment). The PPS resin contains a paraphenylene sulfide unit ##STR1## in an amount of at least 70 mole % of all recurring units. Total amount of PPS resin and the glass-reinforcing agent is at least 60% by weight of the resin composition, and the ratio of the PPS resin to the glass-reinforcing agent is in the range of 2:8 to 9:1 by weight. The other thermoplastic resin, preferably polyester, polyarylate, polyamide, polyetherimide, polyethersulfone and polycarbonate is contained in an amount of 5 to 20% by weight. Typically the acid solution used in A treatment is a mixed liquid of hydrogen peroxide and sulfuric acid, and the organic polar solvent-containing liquid used in C treatment contains N-methylpyrrolidone or dimethylacetamide in an amount of at least 5% by weight. C treatment includes sulfuric acid treatment (C-1 treatment) and/or aqueous alkali solution treatment (C-2 treatment).
公开/授权文献
- US5749881A Laparoscopic surgical clamp 公开/授权日:1998-05-12
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