发明授权
US5194579A Fluorine-containing polyamide acid and polyamide 失效
含氟聚酰胺酸和聚酰胺

Fluorine-containing polyamide acid and polyamide
摘要:
Polyimides represented by general formula (I), (wherein Ar.sub.1 and Ar.sub.2 each represents an aromatic ring-containing group, Cf represents a fluorinated alkyl group directly bonded to Ar.sub.1, and m.gtoreq.1), and polyamide acids as their percursors. The polyimides have excellent humidity resistance and heat resistance, thus being useful as coating materials for semiconductor chips and insulating films for multi-layered wiring. ##STR1##
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