发明授权
US5208463A Method and apparatus for detecting deformations of leads of
semiconductor device
失效
用于检测半导体器件引线变形的方法和装置
- 专利标题: Method and apparatus for detecting deformations of leads of semiconductor device
- 专利标题(中): 用于检测半导体器件引线变形的方法和装置
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申请号: US740605申请日: 1991-08-05
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公开(公告)号: US5208463A公开(公告)日: 1993-05-04
- 发明人: Makoto Honma , Sotozi Hiramoto , Seiji Hata , Masamichi Tomita , Akira Ishibashi
- 申请人: Makoto Honma , Sotozi Hiramoto , Seiji Hata , Masamichi Tomita , Akira Ishibashi
- 申请人地址: JPX Tokyo
- 专利权人: Hitachi, Ltd.
- 当前专利权人: Hitachi, Ltd.
- 当前专利权人地址: JPX Tokyo
- 优先权: JPX2-221302 19900824
- 主分类号: G01B11/00
- IPC分类号: G01B11/00 ; G01B11/24 ; G01N21/956 ; H01L21/66 ; H01L23/50 ; H05K13/08
摘要:
Method and apparatus for detecting vertical and horizontal deformations of leads of a semiconductor device by illuminating the leads with a planar light beam and determining relative positions of the planar light beam on the leads on the basis of distribution of light rays reflected from the leads. Different lead deformations can be detected with one and the same mechanism within a short time. By applying the invention to a semiconductor device mounting apparatus, a single detector can be employed in common both for the detection of the semiconductor device position and the detection of reflections of the planar beam.
公开/授权文献
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