A type of electronic components mounting apparatus is widely known, by which electronic components on an electronic components feeding device are picked up, while pick-and-place heads are being rotated for indexing along a rotary head, and the electronic components are mounted on a circuit board or a substrate positioned on an X-Y table. The electronic components feeding device moves the tables with feeders over a base in lateral direction to supply the electronic components to the feeders on the pick-and-place heads. With increasing demands on high-speed mounting of the components, the moving speed of the above tables must be increased to attain high-speed mounting. The electronic components feeding device according to the present invention comprises a plurality of tables where feeders of the electronic components are placed, a base where these tables are placed, a first feeding means for moving said tables in lateral direction along which said tables are arranged in a feeding area at central part of said base in order to stop said feeders at pickup position of said pick-and-place heads, and a second feeding means for moving said tables between retreat areas on the sides of said base and said feeding area. As the result, the tables can be moved at high speed and can be stopped at correct position with high accuracy.