The winding support comprises a first cylindrical portion (1) which comprises a winding space for a coil winding which is situated between a first wire fastening units (7) and a wire guide (5), and a second portion (3) which is situated in the prolongation thereof and which is shaped as a semi-cylinder with a flat supporting face (17) for mounting an electronic component (23) which comprises contact pads (25, 27). The component (23) is mounted in a recess (19) at the area of the lacking cylinder half, which recess is axially bounded by the wire guide (5) on the one side and by a second wire fastening units (21) on the other side. Lead-out wires (31, 41) of the coil winding are guided, by way of the wire guide (5), across the contact pads (25, 27) to the second wire fastening units (21) whereto they are fastened. Subsequently, soldered or welded joints (43, 45) are formed between the lead-out wires (31, 41) and the contact pads (25, 27) by way of a thermal treatment.