Invention Grant
- Patent Title: Method of assembling an electronic part device
- Patent Title (中): 组装电子部件装置的方法
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Application No.: US924703Application Date: 1992-08-04
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Publication No.: US5210938APublication Date: 1993-05-18
- Inventor: Minoru Hirai
- Applicant: Minoru Hirai
- Applicant Address: JPX Kyoto
- Assignee: Rohm Co., Ltd.
- Current Assignee: Rohm Co., Ltd.
- Current Assignee Address: JPX Kyoto
- Priority: JPX3-221010 19910805
- Main IPC: H01L21/56
- IPC: H01L21/56 ; H01L21/60 ; H05K3/30 ; H05K3/32
Abstract:
In a method of assembling an electronic part device and a circuit board, an electrode formed on the electronic part device and a conductive pattern formed on the circuit board so as to be opposite to the electrode are positioned, and a thermosetting resin sheet including a thermally shrinkable particle and provided between the electronic part device and the circuit board is hardened and shrunk.
Public/Granted literature
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Information query
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