Invention Grant
US5212403A Integrated circuit device having an ic chip mounted on the wiring
substrate and having suitable mutual connections between internal
circuits
失效
具有安装在接线基板上并具有内部电路之间的适当互连的IC芯片的集成电路设备
- Patent Title: Integrated circuit device having an ic chip mounted on the wiring substrate and having suitable mutual connections between internal circuits
- Patent Title (中): 具有安装在接线基板上并具有内部电路之间的适当互连的IC芯片的集成电路设备
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Application No.: US755652Application Date: 1991-09-06
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Publication No.: US5212403APublication Date: 1993-05-18
- Inventor: Keiichirou Nakanishi , Minoru Yamada , Tatsuya Saitoh , Kazumichi Yamamoto
- Applicant: Keiichirou Nakanishi , Minoru Yamada , Tatsuya Saitoh , Kazumichi Yamamoto
- Applicant Address: JPX Tokyo
- Assignee: Hitachi, Ltd.
- Current Assignee: Hitachi, Ltd.
- Current Assignee Address: JPX Tokyo
- Priority: JPX2-236958 19900910
- Main IPC: H01L21/3205
- IPC: H01L21/3205 ; H01L23/498 ; H01L23/52 ; H01L23/538 ; H01L23/64
Abstract:
This invention discloses an integrated circuit device including an integrated circuit chip having logic circuits formed therein and a wiring substrate for mounting thereon the integrated circuit chip. The wiring substrate has signal wirings for connecting mutually input terminals and output terminals of the integrated circuit chip. The integrated circuit device includes signal wirings for effecting connections of the input terminals and output terminals of the same integrated circuit chip inside the wiring substrate. The logic circuits inside the same integrated circuit chip are mutually connected by signal wirings formed inside the integrated circuit chip when a wiring length is small, and are mutually connected by signal wirings formed inside the wiring substrate when the wiring length is great.
Public/Granted literature
- USPP10215P Chrysanthemum plant named `Dark Veria` Public/Granted day:1998-01-27
Information query
IPC分类:
