发明授权
- 专利标题： IC packing device
- 专利标题（中）： IC封装设备
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申请号： US757523申请日： 1991-09-11
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公开(公告)号： US5220486A公开(公告)日： 1993-06-15
- 发明人: Chiaki Takubo , Hiroshi Tazawa , Yoshiharu Tsuboi
- 申请人： Chiaki Takubo , Hiroshi Tazawa , Yoshiharu Tsuboi
- 申请人地址： JPX Kawasaki
- 专利权人： Kabushiki Kaisha Toshiba
- 当前专利权人： Kabushiki Kaisha Toshiba
- 当前专利权人地址： JPX Kawasaki
- 优先权： JPX2-242513 19900914
- 主分类号： H01L21/60
- IPC分类号： H01L21/60 ; H01L23/433 ; H01L23/495
摘要：
An IC packing device comprises a semiconductor device, a piece of flexible resin film provided with an opening for receiving the semiconductor, wires arranged on the piece of flexible resin film and slits cut into the piece of film from the edges of the opening. The slits cut into the flexible resin film allow the film to be flexed downward toward the semiconductor, along with the wires which to establish electrical connection with the semiconductor. In this manner, the downwardly bent flexible film provides reduction in the possibility of a wire breaking due to excessive bending of the wire in order to make contact with the semiconductor.
公开/授权文献
- US5893279A Lid-switch with out-of-balance detection 公开/授权日：1999-04-13
信息查询
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