发明授权
- 专利标题： Plastic mold type semiconductor device
- 专利标题（中）： 塑料模型半导体器件
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申请号： US692893申请日： 1991-04-29
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公开(公告)号： US5223740A公开(公告)日： 1993-06-29
- 发明人: Toshimitsu Ishikawa , Kazuichi Komenaka
- 申请人： Toshimitsu Ishikawa , Kazuichi Komenaka
- 申请人地址： JPX Kawasaki
- 专利权人： Kawasaki Kaisha Toshiba
- 当前专利权人： Kawasaki Kaisha Toshiba
- 当前专利权人地址： JPX Kawasaki
- 优先权： JPX2-112715 19900427; JPX2-324332 19901127
- 主分类号： H01L21/60
- IPC分类号： H01L21/60 ; H01L23/495 ; H01L23/50
摘要：
A plastic mold semiconductor device comprises a semiconductor chip; a die pad which is made of a thin metallic plate for supporting the semiconductor chip; leads which surround the die pad, wires for connecting electrodes on top of the semiconductor chip and the leads; and plastic mold for sealing the entire device; the die pad being comprised of support sections separated by a fixed gap from a sub-element interconnecting member which is insulated from the semiconductor chip, and connection between the power source or signal related lead and the electrode which is on top the semiconductor chip and is located from the power source or signal related lead is connected by the sub-element interconnecting member.
公开/授权文献
- US5791151A Method of preserving tissues and organs 公开/授权日：1998-08-11
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