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US5224356A Method of using thermal energy absorbing and conducting potting materials 失效
使用热能吸收和传导灌封材料的方法

Method of using thermal energy absorbing and conducting potting materials
摘要:
A method of using microencapsulated thermal conducting absorbing materials to cool heat sources is disclosed. Also disclosed are microcapsules containing a thermal energy conducting material. According to the method, these materials may be used alone or as a mixture and may be employed as a powder or incorporated into a hardenable matrix such as an epoxy resin.
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