A preform assembly for use with a resin transfer molding apparatus. The preform comprises an upper liner formed to the shape of a first mold half, the upper liner having a peripheral portion, a dry fabric preform, and a lower liner formed to the shape of a second mold half, the lower liner having a peripheral portion. The preform is sandwiched between the upper liner and lower liner to form the preform assembly having peripheral portions which extend beyond the preform to form a sealing area. The upper liner is sealed to the lower liner at the sealing area. The preform assembly facilitates the loading of the preform into a molding apparatus as well as facilitating the handling and storage of the preform prior to and subsequent to molding. Methods of making the preform assembly, as well as a composite article, are also disclosed