发明授权
US5227232A Conductive tape for semiconductor package, a lead frame without power
buses for lead on chip package, and a semiconductor device with
conductive tape power distribution
失效
用于半导体封装的导电胶带，没有用于芯片封装的电源总线的引线框，以及具有导电带功率分布的半导体器件
- 专利标题： Conductive tape for semiconductor package, a lead frame without power buses for lead on chip package, and a semiconductor device with conductive tape power distribution
- 专利标题（中）： 用于半导体封装的导电胶带，没有用于芯片封装的电源总线的引线框，以及具有导电带功率分布的半导体器件
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申请号： US644729申请日： 1991-01-23
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公开(公告)号： US5227232A公开(公告)日： 1993-07-13
- 发明人: Thiam B. Lim
- 申请人： Thiam B. Lim
- 专利权人： Lim Thiam B
- 当前专利权人： Lim Thiam B
- 主分类号： H01L23/495
- IPC分类号： H01L23/495
摘要：
A conductive tape for a packaged semiconductor device is disclosed. The tape contains a first adhesive layer, a base film on top of the first adhesive layer, a conductive layer on top of the base film layer, and a second adhesive layer on top of the conductive layer. Metal may form the conductive layer. The tape may have slits, slots, or apertures in it so that electrical connection may be made to the conductive layer. Such a tape is useful in lead on chip integrated circuit packages to connect the semiconductor die to the lead frame and to function as a power supply bus by transferring power to the semiconductor die. Wire bonds extending through slots in the second adhesive layer form electrical connection from the lead fingers for receiving power to the conductive layer of the tape. Wire bonds extending from the bonding pads of the semiconductor die through slots the second adhesive layer form electrical connection from the semiconductor die to the conductive layer.
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