发明授权
- 专利标题: Integrated circuit with temperature compensation
- 专利标题(中): 具有温度补偿的集成电路
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申请号: US971708申请日: 1992-11-04
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公开(公告)号: US5229709A公开(公告)日: 1993-07-20
- 发明人: Leonardus C. M. G. Pfennings, deceased
- 申请人: Leonardus C. M. G. Pfennings, deceased
- 申请人地址: NY New York
- 专利权人: U.S. Philips Corp.
- 当前专利权人: U.S. Philips Corp.
- 当前专利权人地址: NY New York
- 优先权: NLX9001493 19900629
- 主分类号: G05F1/625
- IPC分类号: G05F1/625
摘要:
An integrated circuit has an internal supply voltage with a positive temperature coefficient, as a result of which the switching rate and the degree of "hot carrier stress" are less sensitive to temperature. By using a reference voltage source having positive temperature coefficient, the normal effects of increasing temperature on switching rate and "hot carrier stress" are compensated for, thus stabilizing circuit operation as a function of temperature. The reference voltage source is incorporated within a voltage converter which is already present in the circuit, to achieve a compact and efficient configuration.
公开/授权文献
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