发明授权
- 专利标题: High moduli polyimides
- 专利标题(中): 高模数聚氨酯
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申请号: US633069申请日: 1990-12-21
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公开(公告)号: US5243024A公开(公告)日: 1993-09-07
- 发明人: Ronald E. Bockrath , Edward J. Gordon
- 申请人: Ronald E. Bockrath , Edward J. Gordon
- 申请人地址: IL Chicago
- 专利权人: Amoco Corporation
- 当前专利权人: Amoco Corporation
- 当前专利权人地址: IL Chicago
- 主分类号: C08G73/10
- IPC分类号: C08G73/10 ; C08G73/14
摘要:
Improved imide-containing copolymers comprising, in the aromatic diamine component, p-phenylene diamine and at least one additional aromatic diamine have increased rigidity and useful processability. The copolymers of this invention also may exhibit improved resistance to the detrimental effects of humid environments and retain mechanical properties at elevated temperatures after exposure to humid environments.
公开/授权文献
- US5741069A Combined thermometer and radiator cap 公开/授权日:1998-04-21
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