发明授权
US5248519A Process for preparing an assembly of an article and a soluble polyimide
which resists dimensional change, delamination, and debonding when
exposed to changes in temperature
失效
用于制备制品和可溶性聚酰亚胺组合物的方法，其在暴露于温度变化时抵抗尺寸变化，分层和脱粘
- 专利标题： Process for preparing an assembly of an article and a soluble polyimide which resists dimensional change, delamination, and debonding when exposed to changes in temperature
- 专利标题（中）： 用于制备制品和可溶性聚酰亚胺组合物的方法，其在暴露于温度变化时抵抗尺寸变化，分层和脱粘
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申请号： US736667申请日： 1991-07-26
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公开(公告)号： US5248519A公开(公告)日： 1993-09-28
- 发明人: Diane M. Stoakley , Anne K. St. Clair
- 申请人： Diane M. Stoakley , Anne K. St. Clair
- 申请人地址： DC Washington
- 专利权人： The United States of America as represented by the Administrator of the National Aeronautics and Space Administration
- 当前专利权人： The United States of America as represented by the Administrator of the National Aeronautics and Space Administration
- 当前专利权人地址： DC Washington
- 主分类号： B05D1/00
- IPC分类号： B05D1/00 ; B05D7/24 ; C08K5/00 ; H05K1/03
摘要：
An assembly of an article and a polyimide is prepared. The assembly resists dimensional change, delamination, or debonding when exposed to changes in temperature. An article is provided. A soluble polyimide resin solution having a low coefficient of thermal expansion (CTE) was prepared by dissolving the polyimide in solvent and adding a metal ion-containing additive to the solution. Examples of this additive are: Ho(OOCCH.sub.3).sub.3, Er(NPPA).sub.3, TmCl.sub.3, and Er(C.sub.5 H.sub.7 O.sub.2).sub.3. The soluble polyimide resin is combined with the article to form the assembly.
公开/授权文献
- US5860589A Packing box 公开/授权日：1999-01-19
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