A semiconductor lead frame is disclosed to improve the characteristics and reliability of a semiconductor device using lines of bonding pads in a cross-arrangement. The semiconductor lead frame comprises a rectangular semiconductor chip with a plurality of output terminals of associated circuits, a plurality of leads having inner and outer ends, bus bars extending around the inner ends of the leads, at least one insulator disposed between the semiconductor chip and the inner ends of the leads for electrically insulating the chip and the leads, metal wires electrically connecting the inner ends of the leads to selected and respective bonding pads and the bus bars to the pads in common. The leads are inclined relative to the lines of pads to form a line of outer terminals for the lead frame which extend over a distance exceeding the length of the chip. The semiconductor device can thereby accommodate a great number of bonding pads in response to the high density demand without increasing the size of the chip.