发明授权
- 专利标题: Stamp device employing a heat sensitive stencil paper to be perforated by heat of a thermal head
- 专利标题(中): 使用热敏蜡纸通过热头的热穿孔的印章装置
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申请号: US22833申请日: 1993-02-25
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公开(公告)号: US5253581A公开(公告)日: 1993-10-19
- 发明人: Takashi Miki , Tetsuji Fuwa
- 申请人: Takashi Miki , Tetsuji Fuwa
- 申请人地址: JPX Nagoya
- 专利权人: Brother Kogyo Kabushiki Kaisha
- 当前专利权人: Brother Kogyo Kabushiki Kaisha
- 当前专利权人地址: JPX Nagoya
- 优先权: JPX2-417190 19901229; JPX3-104225 19910509; JPX3-121028 19910527
- 主分类号: B41J3/24
- IPC分类号: B41J3/24 ; B41K1/32 ; B41L13/02
摘要:
In a stamping device, a stamping stencil is produced and used which does not require manual application of ink to the stencil. Data concerning an image, which may include character, figure and/or symbol data, is input by a input unit, a thermal head generates heat on the basis of the data and transmits the heat to the thermal stencil paper disposed at the printing position. As a result, a corresponding pattern of pores is produced, by the heat of the thermal head, in the thermal stencil paper. Ink is supplied to the pores by an ink supply unit at an ink supplying position when pressure is applied to the back of the ink supply.
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