Invention Grant
- Patent Title: Low dielectric inorganic composition for multilayer ceramic package
- Patent Title (中): 低介电无机组合物用于多层陶瓷封装
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Application No.: US39542Application Date: 1993-03-29
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Publication No.: US5260119APublication Date: 1993-11-09
- Inventor: Jau-Ho Jean , Tapan K. Gupta , William D. Straub
- Applicant: Jau-Ho Jean , Tapan K. Gupta , William D. Straub
- Applicant Address: PA Pittsburgh
- Assignee: Aluminum Company of America
- Current Assignee: Aluminum Company of America
- Current Assignee Address: PA Pittsburgh
- Main IPC: C03C4/16
- IPC: C03C4/16 ; C03C8/22 ; H01L21/48 ; H01L23/15 ; H05K1/03 ; B32B9/00
Abstract:
A ceramic composition for forming a ceramic dielectric body having a dielectric constant of less than about 4.2. The composition comprises a mixture of finely divided particles of 25-50 vol. % borosilicate glass and 50-75 vol. % high silica glass. The composition can be used with a polymeric binder to produce an unfired green tape which is co-fireable with high conductivity metallurgies such as gold, silver and silver/palladium.
Public/Granted literature
- US6086223A Pad lock lighting devices Public/Granted day:2000-07-11
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