发明授权
- 专利标题： Structure and method for corrosion and stress-resistant interconnecting metallurgy
- 专利标题（中）： 腐蚀和耐应力相互连接冶金的结构和方法
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申请号： US894384申请日： 1992-06-05
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公开(公告)号： US5266522A公开(公告)日： 1993-11-30
- 发明人: Giulio DiGiacomo , Armando S. Cammarano , Nunzio DiPaolo
- 申请人： Giulio DiGiacomo , Armando S. Cammarano , Nunzio DiPaolo
- 申请人地址： NY Armonk
- 专利权人： International Business Machines Corporation
- 当前专利权人： International Business Machines Corporation
- 当前专利权人地址： NY Armonk
- 主分类号： H01L21/48
- IPC分类号： H01L21/48 ; H01L23/498 ; H05K3/24 ; H05K3/38 ; H01L21/44
摘要：
This invention relates generally to structure and method for corrosion- and stress-resistant interconnecting metallurgy, and more specifically to new structures and methods for corrosion- and stress-resistant interconnecting multilayer metallurgical pad comprising sequentially deposited layers of chromium, nickel and noble or relatively noble metal as the interconnecting metallurgy, or multilayer metallurgical pad comprising sequentially deposited layers of chromium, soluble noble metal, nickel and noble or relatively noble metal as the interconnecting metallurgy. This invention also relates to an improved multilayer metallurgical pad or metallurgical structure for mating at least a portion of a pin or a connector or a wire to a substrate.
公开/授权文献
- US4711546A Photometric circuit 公开/授权日：1987-12-08