An interconnect for electrically connecting two members having conductive wiring on respective surfaces thereof includes first and second hinge parts of electrically insulating material which are mutually pivotable when placed in a mating position. The hinge parts have mutually contacting electrically conducting portions when the first and second hinge parts are in their mating position, and the electrically conducting portions are in electrical contact with the conductive wiring on the respective surfaces of the two members. The conductive wiring is arranged on the two members such that when the members are secured, for instance, to assemblies to be interconnected, the conductive wiring aligns with and contacts the desired wires or traces on the interconnected assemblies. In one embodiment, the hinge assemblies are manufactured from a substrate of an electrically insulating polymer matrix which is doped with an electrically insulating fibrous filler capable of heat conversion to an electrically conductive fibrous filler to form a conductive trace. The conductive trace of one assembly is electrically connected to the conductive trace of the other assembly by mating portions of said hinge assemblies, each mating portion including a conductive layer on a surface thereof in direct electrical communication with a corresponding conductive layer on opposing mating portions of said other hinge assembly to provide electrical connection between the conductive traces of said hinge assemblies through a pivotal movement of said one hinge assembly relative to said other hinge assembly. The hinge assemblies may be pivotally interconnected by a hinge pin or by a snap fit relationship between male protrusions on one assembly and female sockets on the other assembly.