发明授权
- 专利标题: Variable rate distribution gas flow reaction chamber
- 专利标题(中): 可变速率分布气流反应室
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申请号: US879545申请日: 1992-05-04
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公开(公告)号: US5269847A公开(公告)日: 1993-12-14
- 发明人: Roger N. Anderson , Paul R. Lindstrom , Wayne Johnson
- 申请人: Roger N. Anderson , Paul R. Lindstrom , Wayne Johnson
- 申请人地址: CA Santa Clara
- 专利权人: Applied Materials, Inc.
- 当前专利权人: Applied Materials, Inc.
- 当前专利权人地址: CA Santa Clara
- 主分类号: C23C16/455
- IPC分类号: C23C16/455 ; H01L21/00
摘要:
A wafer processing reactor having an input manifold to enable control of a process gas flow profile over a wafer that is being processed. Both process gas relative concentrations and flow rates can be controlled, thereby enabling an increased uniformity of processing across the wafer.
公开/授权文献
- US5762624A Venous cannula 公开/授权日:1998-06-09