A composition for removing organic contaminants, such a flux residues, from a solid substrate comprises: (a) hydrogen peroxide in the amount of about 3 to 5 percent by weight of the composition; (b) an alkaline compound in sufficient amount to provide a pH of at least 10.5 in the composition; (c) about 0.1 to 0.3 percent by weight of a chosen wetting agent which is unreactive with the hydrogen peroxide and the alkaline compound; and (d) purified water as the balance of the composition. Optionally, the composition may further comprise about 0.5 to 2.0 percent by weight of a chosen metal protective agent.The solid substrate having organic contaminants thereon is exposed to the above noted composition whereby the organic contaminants are removed from the substrate and are converted into non toxic and non-hazardous products. Thus, negative environmental impact is avoided by the present process. In an alternative embodiment, the organic contaminant removal is further enhanced by exposing the composition and the organic contaminants on the substrate to ultraviolet radiation.