发明授权
- 专利标题： Semiconductor device sealed with mold resin
- 专利标题（中）： 用模具树脂密封的半导体器件
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申请号： US767276申请日： 1991-09-30
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公开(公告)号： US5278451A公开(公告)日： 1994-01-11
- 发明人: Etsushi Adachi , Hiroshi Adachi , Hiroshi Mochizuki
- 申请人： Etsushi Adachi , Hiroshi Adachi , Hiroshi Mochizuki
- 申请人地址： JPX Tokyo
- 专利权人： Mitsubishi Denki Kabushiki Kaisha
- 当前专利权人： Mitsubishi Denki Kabushiki Kaisha
- 当前专利权人地址： JPX Tokyo
- 优先权： JPX2-264674 19901001
- 主分类号： C08L83/02
- IPC分类号： C08L83/02 ; C08L83/04 ; H01L23/29 ; H01L23/31 ; H01L23/28
摘要：
A semiconductor device sealed with mold resin is disclosed. The device includes a semiconductor substrate having a main surface and an element formed on the main surface of the semiconductor substrate. A stress buffering film for protecting at least the element from stress of the mold resin is provided on the semiconductor substrate so as to cover at least the element. The entire semiconductor device is covered and sealed with mold resin. The stress buffering film is formed of organo-silicone ladder polymer having a hydroxyl group at its end. In the semiconductor device, water does not get into an interface of the stress buffering film and the underlying substrate, resulting in an enhancement of the moisture resistance of the semiconductor device.
公开/授权文献
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