发明授权
- 专利标题: Semiconductor sensor
- 专利标题(中): 半导体传感器
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申请号: US848693申请日: 1992-03-09
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公开(公告)号: US5279162A公开(公告)日: 1994-01-18
- 发明人: Katsuhiko Takebe , Mizuho Doi , Hiroyasu Takehara , Satoshi Hiyama , Masanobu Urabe
- 申请人: Katsuhiko Takebe , Mizuho Doi , Hiroyasu Takehara , Satoshi Hiyama , Masanobu Urabe
- 申请人地址: JPX Tokyo
- 专利权人: Honda Giken Kogyo Kabushiki Kaisha
- 当前专利权人: Honda Giken Kogyo Kabushiki Kaisha
- 当前专利权人地址: JPX Tokyo
- 优先权: JPX63-219862 19880902; JPX63-224975 19880908; JPX1-3496 19890110; JPX1-14581 19890124; JPX1-137883 19890531; JPX1-137884 19890531; JPX1-145752 19890608
- 主分类号: G01P15/08
- IPC分类号: G01P15/08 ; G01P15/12 ; G01L9/00 ; H01L29/84
摘要:
This invention relates to a semiconductor sensor for detecting external physical forces, such as acceleration, contact pressures, air pressures, mechanical vibrations, etc. The semiconductor sensor according to this invention is characterized by the use of compound semiconductors of high piezoelectricity, such as GaAs, etc. Conventionally sensors of the cantilever type, diaphragm type, etc. are made of silicon. These prior art sensors have low detection sensitivity, and their characteristics tend to deteriorate. The sensor according to this invention is made of GaAs, which has high piezoelectricity and can retain good characteristics of the semiconductor even at high temperatures and includes a field-effect transistor formed on the GaAs for sensing a stress. The FET is driven by a constant current or a constant voltage so as to detect a change of an electrical characteristic (e.g., threshold characteristic) due to a stress. The structure of the sensor according to this invention enables the sizes of the sensors not only to be diminished but also to reduce the fabrication costs. When a stress is applied to the FET, the transconductance changes, and the temperature changes, consequently the I-V characteristic changes. An a.c. signal biased by a direct current is supplied to the gate of the FET, and a drain current is detected in an a.c. component and a d.c. component so as to detect a temperature concurrently with a detection of a stress.
公开/授权文献
- US5838043A ESD protection circuit located under protected bonding pad 公开/授权日:1998-11-17
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