An apparatus and method for electroplating a graphite-epoxy workpiece in-situ. An electroplating assembly includes a rigid base that is retained a fixed distance about the surface region by insulated standoff legs. A flexible vacuum bag is coupled to the graphite-epoxy workpiece with a fluid-tight seal. The vacuum bag surrounds the surface region and encloses the rigid base to form a plating chamber. A supply chamber, containing a plating fluid, is coupled to the plating chamber by a fluid-tight tubing. A storage chamber is coupled to the plating chamber by a fluid-tight tubing. A vacuum source is coupled by tubing to the supply chamber and to the storage chamber. Valves in each tubing permit the selective coupling of the vacuum source and plating chamber to either the supply chamber or the storage chamber. Electroplating is carried out while plating fluid is drawn by the vacuum, from the supply chamber into the plating chamber and into the storage chamber. When the plating fluid is nearly depleted from the supply chamber, the flow direction is reversed, to draw fluid from the storage chamber, into the plating chamber, and into the supply chamber.