发明授权
- 专利标题： Modular jack
- 专利标题（中）： 模块化插孔
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申请号： US942833申请日： 1992-09-10
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公开(公告)号： US5282759A公开(公告)日： 1994-02-01
- 发明人: Yukio Sakamoto , Iwao Fukutani , Toshio Hori
- 申请人： Yukio Sakamoto , Iwao Fukutani , Toshio Hori
- 申请人地址： JPX Nagaokakyo
- 专利权人： Murata Manufacturing Co., Ltd.
- 当前专利权人： Murata Manufacturing Co., Ltd.
- 当前专利权人地址： JPX Nagaokakyo
- 优先权： JPX3-234286 19910913
- 主分类号： H01R12/70
- IPC分类号： H01R12/70 ; H01R13/7195 ; H01R24/64 ; H01R13/66
摘要：
A modular jack to be mounted on a circuit board, the modular jack having contactors which will come into contact with a plug and terminals which will be connected with printed wires on the circuit board. The contactors and the terminals are stamped out of a hoop and fixed in a body case of the modular jack. An end of the contactors and an end of the terminals are arranged nearby, and filter elements for eliminating noise are disposed between the nearby ends.
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