Invention Grant
- Patent Title: Folded bus bar leadframe
- Patent Title (中): 折叠母线引线框
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Application No.: US941596Application Date: 1992-09-08
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Publication No.: US5286999APublication Date: 1994-02-15
- Inventor: Anthony M. Chiu
- Applicant: Anthony M. Chiu
- Applicant Address: TX Dallas
- Assignee: Texas Instruments Incorporated
- Current Assignee: Texas Instruments Incorporated
- Current Assignee Address: TX Dallas
- Main IPC: H01L23/50
- IPC: H01L23/50 ; H01L23/495 ; H01L23/48
Abstract:
A leadframe has a bus bar extending between two lead fingers on the leadframe. The bus bar and lead fingers are etched to reduce the thickness thereof, and the bus bar is folded under the lead finger, but insulated therefrom by a strip of insulating material. An adhesive is applied to the bus bar to attach it and the leadframe to the surface of a semiconductor chip.
Public/Granted literature
- US4798998A Electronically dimmed power limited lighting system Public/Granted day:1989-01-17
Information query
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