发明授权
- 专利标题： Method of bonding tab inner lead and bonding tool
- 专利标题（中）： 贴片内引线和接合工具的方法
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申请号： US859155申请日： 1992-03-27
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公开(公告)号： US5288006A公开(公告)日： 1994-02-22
- 发明人: Yasuhiro Otsuka , Hideki Kaneko
- 申请人： Yasuhiro Otsuka , Hideki Kaneko
- 申请人地址： JPX
- 专利权人： NEC Corporation
- 当前专利权人： NEC Corporation
- 当前专利权人地址： JPX
- 优先权： JPX3-85895 19910327; JPX3-279370 19911025
- 主分类号： H01L21/60
- IPC分类号： H01L21/60 ; H01L21/607
摘要：
A bonding tool having a round pointed end smaller than the bonding pad for the semiconductor element is urged with a bonding force F.sub.1 and pressed down into the inner lead of a TAB tape such that the bonding tool end and inner lead come in close contact with each other. Then, the bonding force F.sub.1 applied to the tool is reduced to F.sub.2, while at the same time ultrasonic vibration 17 is applied to the tool, thus effecting bonding of the inner lead to the bonding pad with applied heat and pressure. Unlike the prior art, no bump has to be formed on the bonding pad for the semiconductor element or on an end of the inner lead. It is thus possible to simplify the bonding process and also to reduce the cost of bonding. Further, a highly reliable bond can be realized without causing crack or other damage to the pad structure.
公开/授权文献
- US5809576A Attachable pocket 公开/授权日：1998-09-22
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