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US5288774A Novel low-emission, cold-curing binding agents 失效
新型低排放,冷固化粘合剂

Novel low-emission, cold-curing binding agents
摘要:
A binding agent comprising 95 to 50% by weight of a furan resin, 5 to 50% by weight of lignin from the Organosolv process and organic and/or inorganic acid curing agents useful for the production of curable molding compositions, high temperature-stable molding substances and refractory products, especially casting cores and casting molds.
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