A thin semiconductor device (50) can be cost effectively manufactured using conventional wire bonding technology and stamped leadframes. A flagless leadframe (12) is utilized in one embodiment. A support tape (14) having a die support surface (20) is attached transversely to a plurality of leads (18) of the leadframe. A semiconductor die (16) is attached on its active surface to the die support surface such that the active surface is coplanar with the leadframe. Low loop wire bonds (24) electrically connect the die to the leadframe. A resin encapsulant package body (52) is molded around the active surface of the die, the wire bonds, and a portion of the leads. An inactive surface of the die is exposed for enhanced thermal dissipation in addition to enabling a thin package body. External lead configuration of the semiconductor device is not limited.