Invention Grant
- Patent Title: Solder-coated printed circuit board and method of manufacturing the same
- Patent Title (中): 焊接印刷电路板及其制造方法
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Application No.: US852526Application Date: 1992-03-17
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Publication No.: US5296649APublication Date: 1994-03-22
- Inventor: Izumi Kosuga , Kenichi Fuse , Takao Fukunaga , Hirokazu Shiroishi , Masanao Kohno , Hisao Irie
- Applicant: Izumi Kosuga , Kenichi Fuse , Takao Fukunaga , Hirokazu Shiroishi , Masanao Kohno , Hisao Irie
- Applicant Address: JPX Tokyo JPX Hyogo
- Assignee: The Furukawa Electric Co., Ltd.,Harima Chemicals, Inc.
- Current Assignee: The Furukawa Electric Co., Ltd.,Harima Chemicals, Inc.
- Current Assignee Address: JPX Tokyo JPX Hyogo
- Priority: JPX3-84383 19910326; JPX3-84384 19910326
- Main IPC: B23K35/02
- IPC: B23K35/02 ; B23K35/34 ; H05K1/11 ; H05K3/34 ; H05K01/00
Abstract:
A plurality of pads are formed on a circuit board body at a pitch of 0.5 mm or less. The pads are formed such that a projecting height H of a pad from the board body surface and a width W of the pad satisfy a relation 2H D. A solder layer, obtained by a substitution reaction between a powder of a metal having the highest ionization tendency among metals constituting the solder layer or a powder of an alloy thereof and a salt formed by bonding the other metal or metals in the solder layer to an organic acid, is formed on each pad.
Public/Granted literature
- US5799470A Packing machine Public/Granted day:1998-09-01
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