A container or carrier for securely carrying a substrate such as a reticle, mask, wafer, or the like during a semiconductor manufacturing process or during the transport of the substrate. The container includes a housing having an opening through which the substrate may be inserted and removed. The housing includes an open box and a lid, the lid securely held in place by a unique latching mechanism. A door that is hinged upon the lid and held in place by biasing springs substantially seals the housing opening. Within the housing are a plurality of suction cups upon which the substrate rests and which apply suction to firmly engage the substrate on only one side when the substrate is in a contained position. The suction cups hold the substrate in the contained position thereby preventing relative motion between the container and the substrate. The invention further provides for increasing the suction applied by the suction cups to the substrate by applying additional suction to modified suction cups from a vacuum pump. The invention also provides a method for securely containing a substrate within a container. The method including the step of fixing the substrate in a contained position within the substrate using suction.