发明授权
- 专利标题: Mold clamping device in injection molding machine
- 专利标题(中): 注塑机中的模具夹紧装置
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申请号: US11495申请日: 1993-01-29
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公开(公告)号: US5322430A公开(公告)日: 1994-06-21
- 发明人: Toshihiro Kasai , Shinichi Tazawa
- 申请人: Toshihiro Kasai , Shinichi Tazawa
- 申请人地址: JPX Tokyo
- 专利权人: Toshiba Kikai Kabushiki Kaisha
- 当前专利权人: Toshiba Kikai Kabushiki Kaisha
- 当前专利权人地址: JPX Tokyo
- 优先权: JPX4-2994[U] 19920130; JPX4-44873 19920302
- 主分类号: B29C45/64
- IPC分类号: B29C45/64 ; B29C45/66
摘要:
A mold clamping device in an injection molding machine comprising a stationary electromagnetic plate and a movable electromagnetic plate provided at the side of the stationary electromagnetic plate away from the movable platen so as to be capable of being moved toward and away from the stationary electromagnetic plate. Both electromagnetic plates are each provided with an electromagnetic coil for generating a magnetic attracting force. The device further comprises a movable platen driving mechanism which is composed of a combination of a feed screw shaft and a nut member and is connected to the movable platen. An operation for closing the molds is performed by the driving mechanism. Subsequently, a mold clamping operation of both molds is performed by a magnetic attracting force from the electromagnetic coil.
公开/授权文献
- US6004023A Control apparatus for soil improvement machine 公开/授权日:1999-12-21
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